METHOD FOR MANUFACTURING A HEAT-CONDUCTING GASKET FOR HEAT REMOVAL FROM ELECTRONIC COMPONENTS OF PRINTED CIRCUIT BOARDS Russian patent published in 2022 - IPC H05K7/20 H01L23/42 

FIELD: space technology.

SUBSTANCE: invention relates to a method for manufacturing a heat-conducting gasket. The expected result is achieved by the method for manufacturing a heat-conducting gasket for heat removal from electronic components of printed circuit boards, which includes pouring and polymerization of a heat-conducting composite material with reinforcement of an electrical insulating material. At the same time, a workpiece made of mesh material with a thickness less than or equal to the thickness of the adhesive seam corresponding to the size from the housing of the installed electronic component to the printed circuit board is pre-installed on the printed circuit board, made according to the specified dimensions of the gasket. Then, a heat-conducting adhesive-sealant is poured into the workpiece as a heat-conducting composite material, distributed and leveled with a spatula until contact with the surface of the mesh material is aachieved. Moreover, the pouring and polymerization of the heat-conducting adhesive-sealant is carried out directly during installation on the printed circuit board of the electronic component.

EFFECT: better conductive heat removal from the electronic components of printed circuit boards, in order to maintain the thermal mode of operation of the on-board device mainly in the conditions of space vacuum.

2 cl