FABRICATION OF SANDWICHED PCBS Russian patent published in 2016 - IPC H05K3/46 

FIELD: process engineering.

SUBSTANCE: claimed process comprises the making of single-side or two-side PCBs. Plies of adhesive plies are produced and PCBs are stacked with placing the adhesive spacer there between. The stack is subjected to vacuum hot forming. Note here that the assembly of PCBs making the plies of sandwiched PCB is executed by ply-by-ply building up every ply via the spacer onto sandwiched PCB substrate not including the blind transition holes. note here that said blind transition holes are made before build-up of the next ply, tight under the component output sites, then, metalised and copper silted. The surface is processing and ply topology patter is applied. After stack assembly and compaction, through transition metalised holes are made and outer ply pattern of sandwiched PCB is applied.

EFFECT: decreased density of interconnections.

6 dwg