FIELD: instrumentation engineering; data input in miscellaneous devices.
SUBSTANCE: switching device has printed-circuit board with electric wiring layout and contact pads, as well as aluminum or aluminum alloy panel on top. Panel surface facing contact pads is covered with insulating layer provided with holes to open contacting areas in panel. The latter is assembled of separate wafers secured on printed-circuit board, each having at least one hole in insulating layer; used as insulating layer material is anodized layer of wafer and/or insulating material layer applied to wafer. Each wafer may be secured on printed-circuit board by means of adhesive through insulating layer surface contacting the board or by means of additional flexible insulating sheet enclosing wafers on top and fixed to board by means of adhesive over surface contacting it. Additional flexible sheet may be perforated and wafers may be disposed under this sheet in vicinity of holes so that it overlaps wafer edge by minimum 1 mm. Wafer may be coated with anodized layer on surface opposing that bearing holes in insulating layer. Material chosen of group including lavsan, polyethylene, and polyamide can be used as dielectric material for producing insulating layer and additional flexible sheet. Additional flexible sheet can be likewise made of aluminum or its alloys, maximum 0.3 mm thick, whose surface facing printed-circuit board is anodized.
EFFECT: optimized design of device.
7 cl 3 dwg
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SU1830643A1 |
Authors
Dates
2004-08-10—Published
2002-04-15—Filed