MULTILAYER PRINTED CIRCUIT BOARD WITH COMPONENTS Russian patent published in 1994 - IPC

Abstract RU 2010462 C1

FIELD: microelectronics. SUBSTANCE: polyimide substrate is taken and pattern of conductors and lands is formed over its surface by photolithography. Then metallization of surface is conducted by deposition of layer of Cr-Cu-Cr. Metallization layer is reinforced by electrochemical process after removal of photoresist material. Prior to installation of mounted components on back side of substrate section of rigid substrate made of anodized aluminium, 300-7000μm thick, exceeding area of component by 80-120% is connected. Additional metal track 220-300 μm wide which is not only shielding rack but contour for cutting of complex configuration of substrate of printed circuit board is manufactured over perimeter of printed circuit board. EFFECT: enhanced reliability and quality of printed circuit boards with capability of automation of process of manufacture of printed circuit boards. 3 cl, 2 dwg

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RU 2 010 462 C1

Authors

Karasev V.I.

Blinov G.A.

Mitrofanov E.V.

Medvedev Ju.A.

Prasolov V.O.

Dates

1994-03-30—Published

1992-06-09—Filed