PRINTED CIRCUIT BOARD Russian patent published in 1996 - IPC

FIELD: radio engineering, in particular, manufacture of printed circuit boards on metal substrates and can be used in ratio engineering and instrumentation engineering. SUBSTANCE: printed circuit board uses an anodized dielectric substrate and a resistive layer and lands positioned on its surface. The novelty is in the fact that the substrate thickness equals 0.8 to 0.05 mm, substrate anode layer equals 80 to 100 um, and the resistive layer is made of cermet and its thickness h is selected from relationship: $$$, um, where: Uoper. - operating voltage, V; $$$ - surface resistivity of resistive layer, $$$, K- coefficient equal to 180 to 250 $$$. EFFECT: improved design. 1 dwg