FIELD: glass industry.
SUBSTANCE: invention relates to low-melting non-crystallizing glass designated for soldered joints, passivation and hermetic sealing of micro-assemblies and units in instrument making industry, electronic engineering and radioelectronics, in particular, as a soldered joint and sealing agent used in setting up and assembling resonator quartz monometric blocks. Glass comprises components taken in the following ratio, wt.-%: Bi2O3, 24.8-47.0; PbO, 33.8-59.3; ZnO, 8.3-12.3; SiO2, 2.0-2.5; Bi2O3, 5.6-6.8. Glass temperature coefficient of linear expansion (TCLE) is (110-115) x 10-7K-1, soldering point is 450-470oC. Invention provides reducing TCLE value for providing the coordination of glass TCLE value with material to be soldered.
EFFECT: improved and valuable properties of glass.
2 tbl
Title | Year | Author | Number |
---|---|---|---|
FUSIBLE GLASS | 2000 |
|
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RU2196745C2 |
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|
RU2516166C1 |
LOW-FUSIBLE GLASS | 0 |
|
SU1316985A1 |
Authors
Dates
2004-10-10—Published
2003-03-11—Filed