EVAPORATIVE-COOLING SEMICONDUCTOR POWER MODULE Russian patent published in 2004 - IPC

FIELD: electrical and semiconductor engineering; static electrical energy converters.

SUBSTANCE: proposed evaporative-cooling semiconductor power module has plastic case filled with liquid insulating intermediate coolant with semiconductor power structures immersed therein and assembled into three-phase bridge rectifying circuit with aid of three ac current-collecting copper buses ribbed be means of square copper pins and two dc current collecting copper buses also ribbed by means of square pins. Plastic case is connected through sealed joint to outwardly ribbed aluminum condenser provided with internal condensation channels.

EFFECT: enhanced operating currents of semiconductor module due to augmented heat transfer from semiconductor structures.

5 cl, 2 dwg