DEVICE FOR COOLING POWER SEMICONDUCTOR DEVICES Russian patent published in 2015 - IPC H01L23/34 

FIELD: electricity.

SUBSTANCE: device includes a thermal siphon containing a condenser with outer finning and inner condensation channels connected to an evaporator, which is filled with an intermediate liquid heat carrier. The evaporator and condenser are interconnected through a dispensable header and a steam header is placed on top of the condenser. It contains the second identical thermal siphon additionally. Inner vertical fins are placed in the evaporators. Between tubular condensers of the thermal siphons there is an insulating insert. In each thermal siphon the tubular condenser consists of a beam of vertical tubes, each of the tubes having an inner helical fin. Pressure relief valves are fixed rigidly to steam headers of the thermal siphons from the top. The quantity of vertical tubes and their dimensions in the beam of the tubular condenser of one thermal siphon are defined by the formula. Between the tubular condensers of the thermal siphons there is an insulating insert of a moulding material with certain dimensions. The evaporators of the thermal siphons are filled with an intermediate heat carrier, perfluortriethylamine, so that 70-75% of the height of their inner vertical fins is placed in the liquid while the remaining portion of the fins is placed outside of the liquid. Each vertical tube of the tubular condenser has an inner helical fin, which height is defined by the formula.

EFFECT: invention allows improving the efficiency of a cooling device, improving its manufacturability, reducing material consumption, differentiating the design of the device depending on the levels of capabilities of heat losses of the cooled power semiconductor devices.

5 cl, 2 dwg