PLATING METHOD AND APPARATUS Russian patent published in 2005 - IPC

FIELD: plating processes and equipment.

SUBSTANCE: apparatus includes cathode connector for providing contact with plated substrate. Cathode connector has member for engaging with large number of discrete regions of substrate, it passes practically across width of substrate and normally relative to motion direction of substrate (if it moves) and is placed outside plane of substrate. Cathode connector is in the form of elongated connector that may be moved relative to plated substrate and it has main body passing along lengthwise axis of cathode connector and at least one protrusion extending outside of main body. Method is realized due to engagement of cathode connector with large number of discrete regions of plated substrate.

EFFECT: effective guaranteed plating of insulated regions of substrate, of super-flexible substrate and substrate with very rough surface.

37 cl, 5 dwg