FIELD: electronic engineering; printed-circuit board manufacture. SUBSTANCE: method includes electroplating of current- conducting tracks produced by printing them on substrate; substrates carrying current-conducting tracks are covered with galvanic solution by means of device forming first electrode of electroplating circuit while second electrode is formed by electroplated conducting tracks. EFFECT: facilitated procedure, improved quality of printed circuit obtained. 18 cl, 2 dwg
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Authors
Dates
2003-12-10—Published
1999-04-06—Filed