FIELD: metallurgy.
SUBSTANCE: device consists of at least one bath, one anode and one cathode. Also, the bath contains solution of electrolyte. When the cathode contacts surface of substrate subjected to plating, ions of metal settle on electro-conducting surface of substrate. Substrate is transferred through the bath. The cathode contains at least one band with one electro-conduction section enveloping at least two rotating shafts. Additionally, several bands are arranged one after another with a shift. According to the invention the procedure is realised with the device; the band is applied onto substrate and is rotated with the same rate as the rate of substrate transfer through the bath. The invention refers to implementation of the device for application of coating on electro-conducting structures on the carrier not possessing electro-conductivity.
EFFECT: application of thick layers of metals on short structures.
28 cl, 18 dwg
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