CONDUCTING GLUE COMPOSITION Russian patent published in 2005 - IPC

Abstract RU 2246519 C2

FIELD: adhesives.

SUBSTANCE: invention discloses glue compositions, in particular heatproof, easy-to handle, solvent-free conducting glue for low-resistance contact mounting of device structure elements. Glue is particularly suitable in manufacture of semiconductor devices, microwave microcircuits, hydride microwave devices, etc. Glue is based on epoxide resin, namely interaction product of epoxy-titanium-organosilicon resin and tetrabutoxy titanate at ratio 1:0.06. Hardening agent utilized is dimethylamino-substituted 4,4'-diphenylmathanodiisocyanate, metallic filler is fine silver, and diluent is phenol/epichlorohydrin reaction product.

EFFECT: improved performance characteristics.

3 ex

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RU 2 246 519 C2

Authors

Ershova T.N.

Smirnova G.V.

Dates

2005-02-20—Published

2003-04-21—Filed