CURRENT-CONDUCTING ADHESIVE COMPOSITION Russian patent published in 2011 - IPC C09J9/00 C09J9/02 C09J163/00 

FIELD: chemistry.

SUBSTANCE: compositions are meant for strong joints between detecting elements while providing current-conducting contact when assembling components of communications electronics equipment and integrated circuits, especially flexible integrated microcircuits. The current-conducting adhesive composition contains epoxy resin, a hardener and silver powder. The epoxy resin used is a mixture of epoxy diane resin with diglycidyl ether of 1,4 butanediol or a mixture of epoxy diane resin with diglycidyl ether of 1,4 butanediol and diglycidyl ether of an epichlorohydrin homopolymer. The hardener used is a mixture of an amine-type hardener and oligoaminoamide. The silver powder used is silver flake powder and an additional organic solvent.

EFFECT: adhesive composition has low volume resistivity, which provides high structural strength of adhesive joints between aluminium alloys after hardening, high processibility of the obtained adhesive composition which provides quality joints between miniature elements.

6 tbl