ADHESIVE COMPOSITION FOR ELECTRONIC MICROWAVE TECHNOLOGY Russian patent published in 2018 - IPC C09J9/02 C09J163/00 C08K3/22 

FIELD: electronic equipment.

SUBSTANCE: invention relates to adhesive composition for microwave electronic technology. Composition comprises a binder, modified epoxy resin, reaction product of epoxy silane-silicone resin with tetrabutoxy titanate, with component ratio of 1:0.06, respectively, metal filler is finely-dispersed silver powder, diluent is product of reaction of phenol with epichlorohydrin, hardener. In this case, adhesive composition further comprises spreader – organofenoxysilane, powder of finely dispersed silver of metallic filler is made with dispersion of less than 20 mcm, hardener is made in form of solution of 4,4'-diphenylmethane diisocyanate in butyl acetate or solution of 4,4'-diphenylmethane diisocyanate in dimethylacetamide, in following ratio of components, mass%: binder – modified epoxy resin – product of interaction of epoxy-titanium silicone resin with tetrabutoxy titanate 10.2–11.0; metal filler – finely-dispersed silver powder 68.0–72.0; diluent – product of reaction of phenol with epichlorohydrin 10.6–12.5; hardener – in form of solution of 4,4'-diphenylmethane diisocyanate in butyl acetate 3.2–4.4; spreader – organofenoxysilane 4.0–4.1, or binder-modified epoxy resin-product of interaction of epoxy-titanium silicone resin with tetrabutoxy titanate 11.0–15.0; metal filler – finely-dispersed silver powder 68.0–72.0; diluent – product of reaction of phenol with epichlorohydrin 9.6–11.3; hardener – in form of solution of 4,4'-diphenylmethane diisocyanate in dimethylacetamide 2.7–3.7; spreader – organofenoxysilane 3.0–3.7.

EFFECT: increase in electrical and thermal conductivity, increase in homogeneity of structure and reducing the thickness of adhesive seam, increase in applicability by lowering the curing temperature of adhesive composition, reducing microwave losses.

1 cl, 1 tbl