FIELD: electrical and instrumentation engineering, microelectronics.
SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.
EFFECT: enhanced strength and electric conductivity properties of adhesive composition.
5 cl, 2 tbl
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Authors
Dates
2007-10-10—Published
2005-12-27—Filed