METHOD FOR PRODUCING OF FILLED WAFER Russian patent published in 2005 - IPC

FIELD: food-processing industry, in particular, wafer production.

SUBSTANCE: method involves preparing wafer sheets by mixing receipt components; molding resultant mass and baking wafers; preparing filler by mixing filler and flavor additive until homogeneous mass is produced; during mixing procedure, additionally introducing 0.1-10 wt% of component of spicy crop, which is preliminarily washed, dried until moisture content is within the range of 0.1-10%, ground to powder state with particle size of 10-200 microns or to groats state with particle size of 200-5,000 microns and mixing with filler fat component envisaged by receipt until homogeneous mass is produced. Spicy crop components are fruits with seeds of red pepper and/or stigma of flowers of perennial iris plant of saffron, and/or edible part of dill or parsley, or lovage, or coriander, and/or nutmeg with fruit coat, and/or cinnamon, and/or dried flower buds of carnation tree, and/or ginger root, and/or fruit of umbellate plant of anise or caraway, and/or fruit of cardamom. Method further involves spreading layers of filler onto wafers for forming sheets and cutting wafer sheets into individual products. Wafer produced by said method has soft consistency, is free from delamination of wafer from filler, and, also, spicy taste is distributed over the entire volume of product and is kept for prolonged time. Also, wafer keeps its crustiness at any period of year. Method allows wafer shelf life to be increased up to 4 months.

EFFECT: improved quality and prolonged shelf life of product.

15 cl, 79 ex