FIELD: espionage protection techniques.
SUBSTANCE: method includes serial scanning of target surface by nonlinear locator, recording and processing received response in PC with displaying of positions of semiconductor devices. In case of appearance of response on target surface on command from PC visible laser is enabled, response points are lighted by it, pictured using digital camera and recorded in PC. Responses are process in conjunction with target surface image and integral picture of responses is built. On basis of received picture additionally visually detected are potentially possible places for placing semiconductor devices, and also trajectories of tracing of communications on target surface, structures of inbuilt metal construction and anomalies in said structures.
EFFECT: higher precision, higher efficiency, broader functional capabilities.
1 dwg
