FIELD: application of metallic; chemical copper plating of metal and dielectric parts, mechanical rubber goods in particular.
SUBSTANCE: proposed aqueous solution contains, g/l: copper sulfate, 4-5; potassium sodium tartrate (Rochelle salt), 20-22; sodium sulfate, 15-16; sodium hydroxide, 10-12; polyvinyl pyrrolidone, 2-3; ammonium benzoate, 0.05-0.1; formalin, 20-22.
EFFECT: enhanced elasticity of copper coat; enhanced adhesion with surface to be coated; increased rate of reaction.
2 tbl, 1 ex
| Title | Year | Author | Number |
|---|---|---|---|
| SOLUTION FOR CHEMICAL DEPOSITION OF COMPOSITION TYPE COPPER COATINGS | 2005 |
|
RU2283895C1 |
| COMPOSITION FOR RUBBER SURFACE ETCHING | 0 |
|
SU1770344A1 |
| STABILIZER OF CHEMICAL COPPER-PLATING SOLUTIONS | 0 |
|
SU1067080A1 |
| 0 |
|
SU497359A1 | |
| SOLUTION FOR CHEMICAL COPPERING | 2003 |
|
RU2238347C1 |
| SOLUTION FOR CHEMICAL COPPER-PLATING OF DIELECTRICS AND METALS | 0 |
|
SU566890A1 |
| PROCESS OF DEPOSITION OF METAL COATS ON ARTICLES MADE OF MAGNESIUM AND ITS ALLOYS | 1999 |
|
RU2150534C1 |
| PROCESS OF PRODUCTION OF SUPERCONDUCTOR CERAMIC COATINGS OF THE CUPRATE TYPE WITH THE PEROWSKITE STRUCTURE | 0 |
|
SU1830396A1 |
| HIGHLY STABLE SOLUTION FOR CHEMICAL COPPER PLATING OF PCB HOLES | 2022 |
|
RU2792978C1 |
| METHOD OF PLATING LAVSAN FILAMENT WITH NON-DESTRUCTIVE SURFACE ACTIVATION | 2018 |
|
RU2682577C1 |
