FIELD: electronic industry; computers in which processor chips emit high heat.
SUBSTANCE: proposed device has radiator with radial ribs, heat pipes disposed throughout entire width of radiator and over its perimeter in the form of circumference that mounts processor chip, and axial-flow fan disposed on radiator longitudinal axis. Peripheral arrangement of radiator heat pipes and ribs provides for enhanced transfer of heat flux from radiator base to its peripheral region wherein translational-flow speed of cooling air forced by axial-flow fan is maximal.
EFFECT: enhanced efficiency of using cooling air forced by fan to radiator and intensity of heat transfer between heat pipe and ribs.
14 cl, 5 dwg
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