FIELD: electric engineering.
SUBSTANCE: in making method, under increased pressure in reservoir, melted down solder through aperture is applied to board, and in erasing method, under decreased pressure solder is sucked back into reservoir, while reservoir is moved along board surface in accordance to drawing, and devices for making and erasing circuit boards have reservoir with aperture, heater and pump connected to reservoir.
EFFECT: lower laboriousness, simplified construction, lower costs, higher efficiency, higher durability.
4 cl, 1 dwg
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