FIELD: electricity.
SUBSTANCE: dielectric foiled at both sides is used (for instance, in the form of a flexible polymer) and a metal substrate with a plating layer, besides, a solder layer is arranged between them. In the metal substrate of the printed circuit board there might be through holes made for connection with other printed circuit boards. Besides, tinning of the printed circuit board is carried out simultaneously with tinning of the plating layer of the metal substrate, afterwards the printed circuit board billet is soldered to the metal substrate billet. It is possible to simultaneously solder radio elements to contact sites of the printed circuit board.
EFFECT: provision of the possibility to manufacture in conditions of a conventional assembly production facility both rigid and flexible-rigid printed circuit board on a metal substrate having increased strength, resistance to mechanical actions, improved heat removal and screening properties.
4 cl, 2 dwg
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