FIELD: mechanical engineering, can be implemented for manufacture and moisture protection of electronic circuit boards.
SUBSTANCE: porosity in substrate and polymer covering is filled, filling is performed after forming output polymer covering. To fill pores fluid polymerization-capable compositions are used based on glycol ethers of acryl acids, hardened during thermal processing of electronic circuit boards.
EFFECT: higher efficiency of moisture protection of electronic circuit boards.
2 cl, 6 ex
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR PROTECTING ELECTRONIC CIRCUIT BOARDS FROM MOISTURE | 2004 |
|
RU2265976C2 |
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SU1818716A1 |
| STABILIZING ADDITIVE OF POLYMERIZABLE COMPOSITIONS BASED ON GLYCOL ACRYLATE | 1990 |
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| ANAEROBIC COMPOSITION | 1984 |
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| METHOD OF MAKING PROTECTING RELIEFS | 1983 |
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SU1222073A1 |
