FIELD: electronic equipment.
SUBSTANCE: invention relates to the field of electronic technology and can be used in the technological process of manufacturing printed circuit boards intended for operation in extreme conditions (medical equipment, defense industry, nuclear industry, space technology, oil and gas industry, etc.), as well as for sealing of shell-free electronic elements installed on the board. The expected result is achieved by placing the printed circuit board in an envelope made of a fluorinated polymer dielectric material, then air is sucked out of the envelope, thereby creating a vacuum, until the polymer material fits snugly to the surface of the printed circuit board, sealing the shell-free electronic elements installed on the board, thereby providing moisture protection and additional insulation.
EFFECT: creation of a safe method for long-term moisture protection of printed circuit boards.
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