FIELD: mechanical engineering, can be implemented in technology for manufacturing and protecting electronic circuit boards from moisture.
SUBSTANCE: to increase moisture resistance of circuit boards, porosity in volume of dielectric of board is filled, for filling, thermal-hardening polymerization-capable compositions are used based on glycol ethers of acryl acids and additional polymer covering layer is formed. Thermal processing is performed after applying polymer covering.
EFFECT: higher efficiency.
5 ex, 1 tbl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR PROTECTING ELECTRONIC CIRCUIT BOARDS FROM MOISTURE | 2003 |
|
RU2265975C2 |
METHOD FOR MANUFACTURING PROFILED CIRCUIT BOARDS | 2004 |
|
RU2280337C2 |
PROCESS OF MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARDS | 1994 |
|
RU2064736C1 |
METHOD FOR PROTECTING PRINTED CIRCUIT BOARDS FROM MOISTURE | 2020 |
|
RU2756632C1 |
METHOD FOR MOISTURE PROTECTION OF EPOXY FOAMED COMPOUNDS WITH BROKEN SURFACE FILM OF ARTICLES FOR RADIO- AND ELECTRICAL PURPOSES | 2009 |
|
RU2411274C1 |
METHOD OF POTTING OF ARTICLES | 1994 |
|
RU2069461C1 |
METHOD OF MOISTURE-PROOFING OF PRINTED CIRCUIT BOARDS | 0 |
|
SU1818716A1 |
STABILIZING ADDITIVE OF POLYMERIZABLE COMPOSITIONS BASED ON GLYCOL ACRYLATE | 1990 |
|
SU1755563A1 |
ABRASION-RESISTANT PROTECTIVE POLYMERIC COMPOSITION | 2004 |
|
RU2261879C1 |
PHOTOSOLIDIFIED COMPOSITION | 0 |
|
SU883106A1 |
Authors
Dates
2005-12-10—Published
2004-01-14—Filed