METHOD AND DEVICE FOR SELF-RECOVERING CONNECTIONS OF MULTICONTACT INTEGRATED-CIRCUIT DEVICES Russian patent published in 2006 - IPC H01L23/525 

FIELD: interconnecting multicontact electrical, fiber-optic, waveguide, ultrasonic, hydraulic, and gas-air circuits.

SUBSTANCE: proposed method designed to interconnect input/output or central processor devices, or to transfer information or various signals between these devices includes integration of transmitters (leads) of information supply equipment, receivers (leads) of information using equipment, and signal bundle conductor leads into special matrices. Matrix formation needs no strict adherence to order of spatial disposition of its components; they are formed randomly or as it will turn out. Transmitter and receiver matrices are connected to respective matrices of bundled conductor without precisely adhering to their similar relative disposition, the only requirement being coincidence of disposition areas of matrix components. Such mechanical design of connections does not require high precision of manufacture and wiring which essentially reduces their cost and enlarges their functional capabilities. Upon connection and in case of damage to connection communication channels formed in the process are identified and stored. Then each detected and identified communication channel is connected to inputs and outputs of devices being interconnected in compliance with preset connection table or program. Channels are identified sequentially or concurrently. Damaged connection is self-diagnosed and recorded. Proposed method and device are capable of self-recovering their serviceability in case of poor contact, partial break of bundled conductor, deformation of matrices being interconnected, and their relative offset. This capability makes it possible to greatly enhance reliability of multicontact connections. Proposed connection can be used to make sectional devices and to connect integrated circuits incorporating thousands and tens of thousands of communication channels at the same time ensuring their resistance to deformations and other troubles caused by temperature, force, and other impacts. Serviceability of proposed connections is actually independent of manufacturing faults. They can be used in highly intelligent devices, branched neurostructures, and integrated circuits incorporating great number of contacts. They are useful where fast and simple connection of thousands and even tens of thousands of communication channels is required.

EFFECT: ability of self-recovery of multicontact connections dispensing with high-precision mechanical contact devices.

14 cl, 3 dwg, 1 tbl