PRESSURE WELDING METHOD Russian patent published in 2006 - IPC B23K31/02 

FIELD: processes for pressure welding of metallic lead wires, possibly at making power semiconductor devices.

SUBSTANCE: method comprises steps of applying initial pressure to parts; at action of initial pressure upon Y-shaped electrode ultrasonic oscillations are applied in addition; heating parts by means of V-shaped electrode; then applying additional pressure while decreasing amplitude of said oscillations till zero. Invention provides lowered pressure at welding leads on chip and increased contact area of joined surfaces.

EFFECT: enhanced operational reliability of powerful semiconductor devices, improved efficiency of method due to shortened time period for forming welded joints.

2 dwg