FIELD: electric engineering; method of rejecting inner microjoints of semiconductor instruments and device.
SUBSTANCE: according to proposed method, microjoint is acted upon by jet of compressed air. In process of blowing, semiconductor article is connected to static parameters automatic control instrument maximum tolerable voltage is applied to article and, at leakage current equal to zero, defective microjoints in article are revealed.
EFFECT: reduced labor input at inspection and checking.
2 cl, 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| 0 |
|
SU253196A1 | |
| METHOD FOR NONDESTRUCTIVE CHECK FOR MOISTURE CONTENT IN UNDER- PACKAGE SPACE OF INTEGRATED CIRCUITS | 2003 |
|
RU2263369C2 |
| TTL INTEGRATED CIRCUIT INSPECTING METHOD | 0 |
|
SU1056088A1 |
| METHOD FOR REJECTING INTEGRATED CIRCUITS | 2001 |
|
RU2217843C2 |
| METHOD OF SEPARATION OF INTEGRATED CIRCUITS | 2005 |
|
RU2278392C1 |
| METHOD FOR RELIABILITY SEPARATION OF SEMICONDUCTOR PRODUCTS | 2005 |
|
RU2309418C2 |
| PLANT TO TEST STRENGTH OF MICROJOINTS OF SEMICONDUCTOR ARTICLES | 2000 |
|
RU2186366C2 |
| PROCEDURE FOR REJECTION OF BIPOLAR TRANSISTORS | 2001 |
|
RU2204143C2 |
| METHOD FOR DETECTING DEFECTS IN SCHOTTKY FIELD-EFFECT TRANSISTORS MADE ON SEMICONDUCTOR MATERIALS A B | 2022 |
|
RU2792259C1 |
| METHOD OF MONITORING INTEGRATED CIRCUITS BY MOISTURE CONTENT IN UNDER-CASING VOLUME | 2006 |
|
RU2330301C1 |
