FIELD: fluxes for soldering aluminum and its alloys.
SUBSTANCE: flux may be used as filler in tubular low melting lead-tin solders of given kinds. Flux contains, mass %: triethanolamine, 43 - 75; ammonium bifluoride, 25 - 50; acetamide, 0 - 7. Flux provides low temperature of aluminum surface activation in range 250 - 300°C, good spreadability of solder.
EFFECT: improved properties of flux, enhanced efficiency of soldering with use of such flux.
1 tbl, 5 ex
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDERING PASTE | 1994 |
|
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| FLUX FOR LOW-TEMPERATURE SOLDERING | 2005 |
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| SOLDERING PASTE PREPARATION METHOD | 1993 |
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RU2626835C2 |
| MELTED METAL SEPARATING CENTRIFUGE AND METHOD FOR SEPARATING NONFERROUS METALS FROM LUMP WASTES | 1993 |
|
RU2077598C1 |
| FLUX FOR BRAZING AND TINNING ALUMINIUM AND ITS ALLOYS | 0 |
|
SU1364425A1 |
| FLUX FOR SOLDERING AND TINNING WITH USE OF EASY-TO-MELT SOLDER | 2000 |
|
RU2208505C2 |
| FLUX FOR SOLDERING AND TINNING ALUMINIUM AND ITS ALLOYS | 0 |
|
SU959964A1 |
| VACUUM APPARATUS FOR SEPARATION OF BISMUTH FROM TIN ALLOYS | 1995 |
|
RU2107104C1 |
| FLUX GEL FOR ALUMINIUM SOLDERING AND METHOD FOR ITS PRODUCTION | 2016 |
|
RU2627538C2 |
