FIELD: low-temperature soldering of copper and its alloys with use of tin-lead solders.
SUBSTANCE: flux contains, mass %: zinc chloride, 4 - 30; carbamide, 1 - 10; ammonium chloride, 0.5 - 3; sodium chloride 0.5 - 2; water, the balance. When such flux is heated chlorine ions are generated and they provide intensified distortion of oxide film on surfaces of parts of copper and brass. Flux enhances wetting degree of soldered surfaces by solder and it increases surface area of solder spreading. It provides improved strength of soldered joint. In temperature range 200 - 400°C flux is activated.
EFFECT: improved strength of soldered joint.
2 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2001 |
|
RU2204466C2 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2004 |
|
RU2243074C1 |
| ACTIVE BASIS OF FLUX FOR LOW TEMPERATURE BRAZING | 2009 |
|
RU2441737C2 |
| FLUX FOR SOLDERING WITH SOLDERS HAVING LOW CONTENT OF TIN | 0 |
|
SU1442349A1 |
| FLUX FOR SOLDERING AND TINNING WITH USE OF EASY-TO-MELT SOLDER | 2000 |
|
RU2208505C2 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 1991 |
|
RU2008159C1 |
| FLUX FOR LOW TEMPERATURE SOLDERING OF ALUMINUM AND ITS ALLOYS | 2005 |
|
RU2280548C1 |
| FLUX FOR LOW TEMPERATURE SOLDERING | 2009 |
|
RU2400340C1 |
| 0 |
|
SU1780969A1 | |
| SOLDERING FLUX | 0 |
|
SU967752A1 |
