METHOD FOR PRODUCTION OF WAFER PLATES Russian patent published in 2006 - IPC A21D13/08 

Abstract RU 2282361 C2

FIELD: food processing industry, in particular floury confectionery.

SUBSTANCE: wafer plated are prepared according to common technology from dough containing high grade wheat flour and amaranth seed flour, salt, sodium bicarbonate, yolks, vegetable oil and water in claimed ratio.

EFFECT: wafer plates with nut taste and flower.

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RU 2 282 361 C2

Authors

Rosljakov Jurij Fedorovich

Bochkova Lidija Konstantinovna

Shmal'Ko Natal'Ja Anatol'Evna

Tumanjan Rita Pavlovna

Kvasenkov Oleg Ivanovich

Dates

2006-08-27Published

2004-11-15Filed