FIELD: engineering of modules for non-contact chip-cards or identification systems.
SUBSTANCE: module contains first and second antenna contact stripes, which respectively have first and second oppositely positioned surfaces, semiconductor circuit board with at least two contact means, while at least one contact means is in contact with first surface of antenna contact stripe, and at least one other contact means is in contact with first surface of second antenna contact stripe, one stripe of gluing film, which at least partially covers first surface of both first and second antenna contact stripes while at least one stripe of gluing film is applied outside the zone, covered by aforementioned semiconductor circuit board.
EFFECT: provision of durability and stability during manufacture.
6 cl, 3 dwg
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