FIELD: manufacture of semiconductor devices with microground chips. SUBSTANCE: semiconductor device provided with at least one semiconductor chip and with first and second main sides has active structures on first and second main sides interconnected by means of conductors passed through semiconductor chip, at least one semiconductor chip being disposed with one of its main sides on first main side of substrate. The latter has interlayer conductors and nonconducting areas alternately passed at regular distances from first to second main part, distance between interlayer conductors being shorter than between contact leads. EFFECT: enhanced economic efficiency of device manufacture. 7 cl, 3 dwg
