FIELD: manufacture of paper or film chip cards. SUBSTANCE: chip card is made of minimum two paper or film layers used as bearing material; semiconductor chip is disposed on first layer and second layer carries connecting contacts and printed conductors or external contact pads. Semiconductor chip contacts are electrically connected to second-layer contacts. Integrated-circuit module is not required in this case for manufacturing chip cards. Bearing material provided with integrated circuits and contacts can be laminated using endless roll format like in paper manufacture. EFFECT: enlarged quantity of chip cards that can be manufactured by this method. 4 cl, 2 dwg
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