LEAD PLATING ELECTROLYTE Russian patent published in 2007 - IPC C25D3/36

Abstract RU 2291230 C1

FIELD: electroplating, possibly in machine engineering for applying coatings with improved corrosion resistance.

SUBSTANCE: electrolyte contains, g/l: lead nitrate 15 -25; Trilon, 30 - 40; ammonium acetate, 20 - 30; sodium dodecyl sulfate, 0.1 - 0.2.

EFFECT: enhanced dispersing capability of electrolyte, improved corrosion resistance of coating.

1 tbl, 3 ex

Title	Year	Author	Number
ELECTROLYTE FOR DEPOSITION OF ALLOY LEAD-INDIUM	2007	Povetkin Viktor Vasil'Evich Shibleva Tat'Jana Grigor'Evna Shindler Roman Viktorovich	RU2343233C1
ELECTROLYTE FOR DEPOSITING SILVER-LEAD ALLOY	2006	Povetkin Viktor Vladimirovich Ivanova Tat'Jana Evgen'Evna Cherepjanskij Vasilij Vladimirovich	RU2303662C1
ELECTROLYTE FOR INDIUM DEPOSITION	2007	Povetkin Viktor Vasil'Evich Shibleva Tat'Jana Grigor'Evna Kislitsina Natal'Ja Aleksandrovna	RU2346088C1
ELECTROLYTE FOR DEPOSITING SILVER-RHENIUM ALLOY	2011	Shibleva Tat'Jana Grigor'Evna Povetkin Viktor Vladimirovich Ivanova Tat'Jana Evgen'Evna	RU2459017C1
ELECTROLYTE FOR DEPOSITING COPPER-RHENIUM ALLOY	2002	Povetkin V.V. Skifskij S.V. Koreshkova E.V.	RU2234560C1
ELECTROLYTE FOR DEPOSITING BISMUTH-LEAD ALLOY	1996	Povetkin V.V. Devjatkova O.V. Danchuk L.N.	RU2105830C1
ZINC-PLUMBUM ALLOY DEPOSITION ELECTROLYTE	1997	Povetkin V.V. Danchuk L.N.	RU2118671C1
ELECTROLYTE FOR DEPOSITION OF COPPER-GERMANIUM ALLOY	2011	Shibleva Tat'Jana Grigor'Evna Povetkin Viktor Vladimirovich	RU2457289C1
ELECTROLYTE FOR DEPOSITING COPPER-COBALT ALLOY	1996	Povetkin V.V. Devjatkova O.V.	RU2101395C1
ELECTROLYTE FOR DEPOSITION OF ALLOY COPPER-MOLYBDENUM	1999	Povetkin V.V.	RU2149928C1

Authors

Shibleva Tat'Jana Grigor'Evna

Povetkin Viktor Vasil'Evich

Dates

2007-01-10—Published

2005-06-10—Filed