FIELD: metallurgy, electrolysis.
SUBSTANCE: invention concerns field of galvanostegy and can be used at plating made of indium. Electrolyte contains, g/l: sulfuric indium 20-40, acetous ammonium 30-40, trilon B 40-50, sodium dodecyl sulfate 0.1-0.3, thiourea 0.3-0.5.
EFFECT: hardening and increasing of corrosion stability of coatings.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR DEPOSITION OF SILVER-INDIUM ALLOY | 2009 |
|
RU2386731C1 |
| ELECTROLYTE FOR DEPOSITION OF ALLOY LEAD-INDIUM | 2007 |
|
RU2343233C1 |
| LEAD PLATING ELECTROLYTE | 2005 |
|
RU2291230C1 |
| ELECTROLYTE FOR DEPOSITION OF COPPER-INDIUM ALLOY | 1998 |
|
RU2134734C1 |
| ELECTROLYTE FOR SEDIMENTATION OF FERRO-CHROME ALLOY | 2004 |
|
RU2248415C1 |
| ELECTROLYTE FOR DEPOSITION OF COPPER-GERMANIUM ALLOY | 2011 |
|
RU2457289C1 |
| ELECTROLYTE FOR DEPOSITING COPPER-COBALT ALLOY | 1996 |
|
RU2101395C1 |
| ELECTROLYTE FOR DEPOSITING ARGENTUM-THALLIUM ALLOY | 2001 |
|
RU2190043C1 |
| ELECTROLYTE FOR DEPOSITING COATING FROM COPPER-INDIUM ALLOY | 2017 |
|
RU2665855C1 |
| ELECTROLYTE FOR DEPOSITION OF BISMUTH-GALLIUM ALLOY | 2009 |
|
RU2410474C2 |
