METHOD AND DEVICE FOR REALIZATION OF THROUGH CONNECTIONS IN SUBSTRATES AND ELECTRONIC BOARDS Russian patent published in 2007 - IPC H05K3/40 

FIELD: electric engineering for manufacturing blocks of elements of electric equipment, in particular, during realization of flexible through connections in substrates of electronic boards.

SUBSTANCE: when making through connections in flexible substrates 1 of electronic boards for providing electric contact between two electro-conductive contact portions 3,41 positioned on opposite surfaces 1a,1b of substrate, in zone of these contact portions, in the surface, slit 11 is made at an angle to its surfaces, and both portions 20,30 of substrate adjacent to inclined slit 11 are shifted relatively to each other, driving them to mutually opposite sides until one jumps behind another. Shifting relatively to one another of these portions of substrate is provided for by means of pusher 12 under effect of compressed air 13, due to creation of depression 14, or by means of catching hook 15 held on cutting tool. Both stages, one of which includes making a slit in substrate, and another one- shifting of portions of substrate relatively to one another by means of driving them to mutually opposite sides, are performed on one and the same processing position, preferably during one operation.

EFFECT: simplicity and reliability.

2 cl, 10 dwg