HEAT-RESISTANT ADHESIVE COMPOSITION Russian patent published in 2016 - IPC C09J163/00 

FIELD: chemistry.

SUBSTANCE: invention relates to heat resistant cold setting adhesive compositions. Heat-resistant adhesive composition of cold hardening comprises epoxy organosilicon resin and mixture of isomers γ- and β-aminopropyl triethoxysilane and tris-[2,4,6-(dimethyl aminomethyl)phenol]. At that, it additionally contains synthetic corundum with grain size of 7-10 mqm or boron carbide with grain size of main fraction from 3 to 7 mqm. Epoxy organosilicon resin has weight ratio of epoxy groups from 15.5 to 16.9 % and weight ratio of silicon from 5.0 to 5.3 %. Composition has following ratio of components, wt%: epoxy organosilicon resin with weight ratio of epoxy groups from 15.5 to 16.9 % and weight fraction of silicon from 5.0 to 5.3 %-100, mixture of isomers γ-and β-aminopropyl triethoxysilane - 25-35, tris-[2,4,6-(dimethyl aminomethyl)phenol] - 1-2, synthetic corundum with main grain size of 7-10 mqm or boron carbide with grain size of main fraction from 3 to 7 mqm - 160-250.

EFFECT: technical result achieved by using composition according to invention consists in high heat resistance of adhesive composition to the temperature of 500 °C and stability of adhesive joints to cyclic temperature drop from 20 to 200 °C.

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