FIELD: measuring technique.
SUBSTANCE: method comprises cutting the substrate out of the solid film without defects having higher deformation capability in comparison with the material to be tested. The thickness of the substrate material is determined from the formula proposed. The specimen is applied on the substrate and the stack obtained is set in the matrix and is clamped by means of the punch. The stack is loaded from the side of the substrate and the current pressure is recorded. The procedure is repeated for the substrate only. The strength characteristics of the material to be tested is determined from the formula presented.
EFFECT: expanded functional capabilities and reduced cost.
2 cl, 10 dwg
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