FIELD: methods for manufacturing contacts of chip-resistors in thick-film technology, possible use in electronic, radio-technical and other adjacent industrial branches during manufacture of resistors using thick-film technology.
SUBSTANCE: method for forming contacts of chip-resistors in thick-film technology includes creation of contact areas by application to ceramic substrates using stenciling method with following firing of silver-containing paste and dipping of substrate ends into silver-containing alloy, prior to application of nickel layer by galvanic method with following application of soldering alloy layer also by galvanic method, a layer of copper is applied.
EFFECT: increased reliability of inter-contact connections of chip-resistors made using thick-film technology.
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