METHOD OF ASSEMBLING THREE-DIMENSIONAL ELECTRONIC MODULE Russian patent published in 2013 - IPC H01L25/04 H01L21/02 H05K3/40 H05K1/14 

FIELD: electricity.

SUBSTANCE: in the method of assembling a three-dimensional electronic module, involving arranging electronic components and microboards, having contact pads on end surfaces parallel to each other, electrical connection thereof on lateral surfaces of the module inspection and sealing thereof, the starting components are used are guaranteed non-defective components; said components and the microboards are used to spatially oriented contact pats for forming a continuous line of the design of the module; an adhesive heat-conducting electrically-insulating composition is applied in a measured manner on the ends of the microboards to provide a monolithic and continuous adhesive joint; electronic components are merged on contact pads and connected; the adhesive composition is polymerised; the contact pads of the electronic components and microboards are cleaned from the film of the adhesive composition; conductors are sprayed onto the faces of the glued three-dimensional electronic module, said conductors providing the necessary connections between electronic components and microboards on their contact pads; conductors lying on the faces of the three-dimensional electronic module are grown.

EFFECT: providing high reliability of connections between electronic components that are part of a three-dimensional electronic module while increasing packing density owing to minimal interconnections.

8 cl, 5 dwg