TWO-PHASE COPPER-NICKEL-SILICON HARDENING SUBSTRATE Russian patent published in 2008 - IPC C22C9/06 B22D11/06 

FIELD: metallurgy; hardening substrates used for manufacture of bands by fast hardening of molten alloy.

SUBSTANCE: proposed copper-nickel-silicon hardening substrate is made from heat-conducting alloy containing the following constituents: approximately 6-8 mass-% of nickel; approximately 1-2 mass-% of silicon, approximately 0.3-0.8 mass-% of chromium, the remainder being copper and unintentional impurities; substrate has cellular two-phase microstructure with copper-enriched areas surrounded by net of nickel silicide phases; structure is homogeneous and size of meshes ranges from 1 to 1000 mcm. Method of forming the hardening substrate of casting wheel includes the following stages: casting of blank from two-phase copper-nickel-silicon alloy containing the following constituents: approximately 6-8 mass-% of nickel; approximately 1-2 mass-% of silicon; approximately 0.3-0.8 mass-% of chromium; the remainder being copper and unintentional impurities; machining of blank for forming the casting wheel hardening substrate and heat treatment of substrate for obtaining two-phase microstructure having meshes of 1-1000 mcm in size. Casting of strip is performed at minimum degradation of surface depending on casting time.

EFFECT: increased amount of material cast during each cycle at reduced toxicity characterizing copper-beryllium substrates.

7 cl, 7 dwg, 1 tbl, 3 ex