FIELD: chemical industry; other industries; methods and devices for compaction of porous substrates by- the gaseous phase chemical infiltration.
SUBSTANCE: invention is pertaining to the field of compaction of porous substrates by- the gaseous phase chemical infiltration. Exercise loading of substrates exposed to compaction- into the furnace loading area; heat up substrates in the furnace up to their temperature, at which the required substance of the mold will be formed from the gaseous source or sources contained in the gas-reactant. Then- on the one hand of the furnace inject gas-reagent and heat it up after injection- during its transit in the furnace through the gas heating area located- in the direction of the gas-reagent travel through the furnace in front of the loading area. Gas-reactant is exposed to preheating before its injection in the furnace for reaching prior its injection in the furnace of the temperature intermediate -between the environment temperature and the substrates preheating temperature. Installation includes the furnace, the area of substrates loading in the furnace, the means of heating of substrates in the loading area, at least, one hole for the gas-reagent injection in the furnace and, at least, one heating area of the gas-reagent disposed in the furnace between the hole of the gas-reagent injection and the loading area. Installation also contains, at least, one gas preheating device disposed out of the furnace and connected, at least, with one hole used for injection of the gas-reagentin the furnace and ensuring- preliminary heating up of the gas-reagent before its injection in the furnace. The presented method and the device allow to reduce significantly the temperature gradient in the whole area of loading without usage of the large the volume of the gas-reagent heating area.
EFFECT: invention allows to reduce significantly the temperature gradient in the whole area of loading without usage of the large the volume of the gas-reagent heating area.
24 cl, 7 dwg
Authors
Dates
2008-03-20—Published
2002-12-24—Filed