METHOD FOR MANUFACTURING OF LAMINATED REMOTE-CONTACT CHIP CARDS Russian patent published in 2000 - IPC

Abstract RU 2158204 C1

FIELD: electronic equipment. SUBSTANCE: method involves mounting of continuous rod film over base Inlet film. Continuous rod film is made from thermo-softening polymer material, which height is greater than height of chip flaring over base Inlet film by at least 50 micron. EFFECT: improved quality. 5 cl, 2 dwg

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RU 2 158 204 C1

Authors

Ajbazov O.U.

Prass M.A.

Rodionov T.M.

Olikov E.N.

Dembovskaja Ju.V.

Dates

2000-10-27—Published

2000-03-17—Filed