FIELD: technological processes.
SUBSTANCE: invention may be used in electronic industry as optical marks and dashes in manufacture of current-conducting paths in different instruments, and also in manufacture of different luminescent instruments. Method of brittle nonmetal materials cutting includes preliminary making of cut along cutting line at the edge of billet, heating of material along cutting line with laser bundle at relative displacement of billet and bundle and local cooling of heating zone with the help of coolant in the form of air-water aerosol. Cooling of cutting line is carried out with coolant in the form of two-level disperse system that consists of dispersed air medium and two-phase composition of dispersed phase, which includes water drops as the first dispersed phase, and colloidal composition or hard microparticles with size from 1 nm to 100 micrometer as the second dispersed phase.
EFFECT: development of method for crack parameters control during thermal splitting for preparation of visible cutting line with preset width and depth.
8 cl, 5 dwg, 5 ex
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Authors
Dates
2008-09-10—Published
2007-07-09—Filed