FIELD: chemistry.
SUBSTANCE: method of cutting device plates into crystals involves making a local incision at the edge of a workpiece, heating cutting line with a laser elliptic beam and then cooling the heating zone using a coolant with relative displacement of the plate and the leaser beam with the coolant. The method also involves making an incision on the entire length of each cut in at least one of two cutting directions or at least at points of intersection with cutting lines in the second direction, wherein the incision on the entire length of the cut is made before cutting in that direction.
EFFECT: high efficiency of cutting device plates to crystals on intersecting lines owing to use of controlled laser thermocleavage.
8 cl, 12 dwg, 3 ex
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