FIELD: performing operations.
SUBSTANCE: invention relates to methods of cutting non-metallic materials, particularly quartz glass, silicon, silicon carbide and other brittle heat-resistant materials. Disclosed is a method for laser cutting of ingots of non-metallic materials into plates, according to which a notch is created in the volume of a sample of non-metallic material with focused laser radiation, and then the surface of the ingot is heated with laser radiation, for which the material is opaque, with relative movement of the laser beam and the material sample. In this case, the incision is created with laser radiation focused into a spot with diameter of 10-100 mcm from a pulsed picosecond or femtosecond laser, on the side of the surface of the sample of non-metallic material in the form of at least two local stress concentrators arranged along the cutting line at a depth of h = 0.1-1 mm. Distance between local stress concentrators is selected based on the condition of formation of a crack between local defects due to summation of thermoelastic stresses at points of these defects and is equal to 0.01-0.5 mm. Thereafter, heating is performed on the side of the surface of the sample of non-metallic material by scanning with a laser radiation beam. Power density and linear velocity of laser radiation are selected based on the condition of creating tensile stresses at the depth of the material sample, which is equal to the specified thickness of the cut plate.
EFFECT: high quality of cutting non-metallic materials into plates.
1 cl, 1 dwg
