FIELD: various technological processes.
SUBSTANCE: invention relates to methods of cutting ingots of non-metallic materials, in particular silicon carbide, silicon, gallium arsenide, germanium, sapphire and other brittle non-metallic materials, into plates. Disclosed is a method for laser cutting of ingots of non-metallic materials into plates, according to which a notch is created in the volume of a sample of non-metallic material with focused laser radiation, and then the ingot surface is heated by laser radiation, for which the material is opaque, with relative movement of the laser beam and the material sample. Notch is created on the side of the end of the sample of non-metallic material by focused laser radiation with wavelength for which the material is transparent, in the form of local stress concentrators arranged in series along the cutting line at a depth equal to the thickness of the cut plate. Heating from the side of the surface of the sample of non-metallic material is carried out by scanning with a laser beam, power density and linear speed of which are selected based on the condition of creation of tensile stresses exceeding ultimate tensile strength of the material at the depth of the material sample equal to the specified thickness of the cut plate.
EFFECT: high quality of cutting non-metallic materials into plates.
10 cl, 2 dwg
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Authors
Dates
2024-10-30—Published
2024-05-02—Filed