FIELD: technological processes.
SUBSTANCE: method includes spatial positioning of diamond processed surface in relation to cutting plane and laser beam focus, which is executed between working passes along the third linear coordinate, and stepped formation of slit with laser beam. At that working passes are carried out by scanning of laser beam along formed slit in fixed diamond, in the process of positioning of which slit is additionally rotated in relation to laser beam around axis that passes through its focus and is located in scanning plane.
EFFECT: provision of precision accuracy of diamonds cutting with formation of narrower and deeper slit with high purity of processing with reduction of diamond material consumption.
2 cl, 2 dwg
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