THIN-FILM MATERIAL AND METHOD OF THIN-FILM MATERIAL PRODUCTION Russian patent published in 2008 - IPC B01J13/14 C08J5/18 C08J7/04 

Abstract RU 2336941 C1

FIELD: technological processes.

SUBSTANCE: invention may be used for development of new nano-structured thin-film materials applied in systems of controlled transport and delivery of micron, submicron and molecular objects in liquid phase, in technologies of bioengineering, in nano-metrical assembly technologies, in analytic, sensor, biomedical, cosmetic, catalytic, membrane technologies. Thin-film material is made in the form of free thin film in liquid phase that includes colloidal particles, which are chemically connected between each other in the film plane, at that components of material separately are able to form solutions in liquid phase. Material is formed by the method on the basis of self-assembly and self-organisation effects of low-dimensional structures directly in the volume of liquid phase. Initial solutions of material individual components are prepared, and liquid phase that contains prepared thin-film material is formed. Processes of binding and creation of chemical links are carried out between colloidal particles by means of single or multiple addition of solution that contains one or several reagents or components into solution of another component or other components of prepared thin-film material. Formation of material thin-film structure is performed in the volume of liquid phase for the time sufficient for processes of material components binding and creation of free thin-film structure. Thin-film material is applied as a layer on the surface of extended articles - threads, wire, rods, etc.

EFFECT: method of thin-film material production is environmentally safe; provides higher material output and suggests possibility of technological process automation.

25 cl, 17 dwg, 1 ex

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RU 2 336 941 C1

Authors

Koksharov Jurij Alekseevich

Khomutov Gennadij Borisovich

Kislov Vladimir Vladimirovich

Taranov Igor' Vladimirovich

Dates

2008-10-27Published

2006-12-29Filed