SOLDER PASTE Russian patent published in 2017 - IPC B23K35/36 B23K35/363 

FIELD: printing industry.

SUBSTANCE: solder paste contains, wt %: low-temperature solder powder 80…91 and the flux-bundle 9…20. The flux-bundle includes components in the following ratio, wt %: pine rosin 30…60, a mixture of high boiling and low boiling organic solvents in the form of ethers and/or alcohols 35…70, activators in the form of a salt or a salt mixture of primary amines with organic acids 1…8.

EFFECT: paste ensures reliability of the soldering of highly oxidized printed-circuit boards and radio electronic components with a long shelf life, designed for operation in severe operating conditions.

1 dwg, 4 tbl